Professional Engagement
Conferences, workshops, and presentations
Presenting accepted paper on system-level modeling of a membrane-assisted two-phase cooling architecture for 1 MW data center racks.
Follow-up online tutorial session for participants who could not attend the in-person workshop in St. Louis. Highly interactive with strong attendance and active engagement throughout.
Presented MOSTCOOL and the COOLERCHIPS effort to the electronics thermal management community in San Jose. Led booth activities and engaged with industry leaders in two-phase cooling and reliability.
Organized and delivered the first MOSTCOOL workshop in St. Louis, co-located with the Supercomputing conference during the ARPA-E review. Release 3.0 was introduced with expanded flow network modeling capabilities.
Presented MOSTCOOL two-phase cooling module and its prototype capabilities with different refrigerant fluids. Received very positive feedback from experts in electronics packaging and thermal management.
Selected for an interactive poster presentation at OCP San Jose. Presented MOSTCOOL to major industry players working on advanced thermal management for high-density and AI-driven data centers.
Prof. McCluskey delivered a professional development course on data center thermal management and reliability at the 75th IEEE ECTC. Showcased MOSTCOOL as a platform for integrated thermal and reliability evaluation.
Presented the new two-phase cooling module at the 2025 ARPA-E Summit in Washington D.C. Showcased expanding MOSTCOOL capabilities to the broader energy and cooling innovation community.
Participated in the ARPA-E Energy Innovation Summit as part of the COOLERCHIPS program. Demonstrated the initial MOSTCOOL prototype and engaged with other performers to understand modeling needs.